On July 9th, Samsung will hold its Unpacked event in New York, where it will present the new Galaxy Z Fold 7 and Galaxy Z Flip 7 foldable smartphones, and rumors claim that the manufacturer will take the opportunity to reveal more about the famous tri-fold model, already mentioned at the beginning of the year.
Samsung 3-panel smartphone, main specifications hinted££££
While waiting for this new teaser, the leaker PandaFlash has gotten his hands on some details about the device, not much, it is true, but enough to keep us going before learning more. We thus learn that the smartphone's body would be made of both aluminum and titanium for increased strength. The processor would be supplied by Qualcomm and it should be a Snapdragon 8 Elite, a chip currently used on high-end Android devices.
Finally, the main screen would not have a hidden camera under the screen (UPC). Very sparse information, then, and we should learn more at the Unpacked event in early July. To be precise, the latest rumors estimate that the device will be released next October.